Principal Engineer, Process Engineering (PEALD SiN)
Core
Developing and optimizing advanced semiconductor deposition processes (PEALD, ALD, PECVD, CVD, Epitaxy) for next-generation devices.
Role type
Principal Engineer, Process Engineering (R&D)
Builds
Thin film deposition processes and materials for emerging semiconductor applications
Domain
Semiconductor manufacturing / Chemical Engineering / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PEALD, ALD, PECVD, CVD, Epitaxy, Design of Experiments (DOE), Response Surface Methodology (RSM), thin film deposition principles, semiconductor process development, materials characterization (XPS, SIMS, AFM, XRD, TEM, SEM, Raman, ellipsometry), technical documentation, customer demonstration
Preferred skills
Electrical characterization for CMOS devices, FEOL/BEOL process flow integration, technical publications and patent authoring
Technologies
PEALD, ALD, PECVD, CVD, Epitaxy, XPS, SIMS, AFM, XRD, TEM, SEM, Raman, ellipsometry
Responsibilities
Researching and optimizing thin film deposition processes; designing and executing complex experiments; developing new film materials and processes; troubleshooting process and equipment issues; collaborating with customers to define requirements and execute demonstrations; supporting product transfer via training and site visits; authoring technical papers and IP.
Seniority
Principal, hands-on IC with strategy & mentorship