Senior Principal Engineer, Mechanical Engineering
Core
Define long-term electrical technology roadmaps and govern system architecture for advanced packaging semiconductor equipment platforms.
Role type
Senior Principal Electrical Engineer (Semiconductor Capital Equipment)
Builds
Advanced packaging semiconductor equipment platforms (RF power systems, power distribution, motion control, safety systems, sensors)
Domain
Semiconductor manufacturing equipment / Electrical Engineering
Deliverable
production ML models | product features | infrastructure
Required skills
RF systems, power electronics, motion control, safety systems, electrical architecture, SEMI standards, EMC/EMI, grounding, functional safety, cross-functional leadership, technology roadmap definition
Preferred skills
Advanced packaging, plasma processing, etch, deposition, wafer-level packaging, patent portfolio, product roadmap strategy, customer engagement
Technologies
RF power systems, power distribution, motion control, safety systems, sensors
Responsibilities
Own enterprise-level electrical architecture strategy; Define technology roadmaps for RF power systems, power distribution, motion control, safety systems, sensors, and advanced electronics; Lead architecture governance and executive design reviews; Drive innovation, intellectual property creation, and technology differentiation; Provide technical leadership for critical customer escalations and complex field issues; Establish electrical engineering standards, design methodologies, and best practices; Lead cross-functional teams spanning systems, process, mechanical, software, manufacturing, and suppliers; Own EMC/EMI, grounding, CE/UL, SEMI, and global compliance strategies; Mentor principal engineers and develop organizational technical capability; Influence product strategy, new platform development, and corporate technology investments
Seniority
Principal, strategy & mentorship
