Senior Engineer, Process Engineering (Advanced Packaging)
Core
Drive development, qualification, and customer adoption of advanced thin film deposition solutions for semiconductor packaging applications.
Role type
Senior IC process engineer (thin film deposition)
Builds
Thin film deposition equipment and processes for semiconductor packaging
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin film deposition process development, Plasma etching, Cleaning processes, Hardware qualification, Customer site troubleshooting, Project planning, Experimental design
Preferred skills
Customer-facing technology adoption, Cross-functional R&D partnership, International assignment adaptability
Technologies
Plasma etching, Thin film deposition, Semiconductor packaging equipment
Responsibilities
Lead hardware and process qualification of thin film deposition equipment at customer sites, Develop and optimize plasma etching, cleaning, and thin film deposition processes, Execute customer demonstrations and process evaluations, Collaborate with customers across Asia to drive product adoption, Partner with R&D and Global Product Management to convert requirements into product enhancements, Support customer escalations to deliver sustainable solutions
Seniority
Senior, hands-on IC
