Senior Principal Engineer, Mechanical Engineering, Advanced Packaging
Core
Design and develop next-generation semiconductor equipment for advanced packaging, ensuring reliable performance from concept through high-volume manufacturing.
Role type
Senior Principal Mechanical Engineer (Semiconductor Equipment)
Builds
Semiconductor manufacturing tools and systems for advanced packaging
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
System-level thinking, root cause analysis, project management, BOM management, NPI support, cross-functional collaboration, technical documentation, continuous improvement
Preferred skills
Plasma/vacuum/gas delivery knowledge, fab environment experience, global initiative leadership, mentorship
Technologies
Semiconductor equipment, automation systems, manufacturing tools
Responsibilities
Design and develop semiconductor systems including equipment selection and automation integration; Manage project timelines, budgets, and resources; Provide technical support and troubleshooting for equipment and automation systems; Own BOM release and maintenance; Drive continuous improvement initiatives; Prepare comprehensive design documentation for prototypes and production products; Act as a system-level technical expert in development labs and customer fabs; Diagnose and resolve advanced system, hardware, and process issues; Support new product introduction (NPI) including early builds and ramp to high-volume manufacturing; Lead or support first-in-fab deployments; Translate field and customer feedback into design improvements; Contribute to yield improvement and uptime; Develop and share best practices and global standards; Collaborate with hardware, software, controls, and process engineering teams; Lead or support global initiatives and mentor engineers.
Seniority
Senior, hands-on IC with mentorship responsibilities
