Director / MTS, Heaters and Electrostatic Chuck (ESC)
Core
Design and deliver hardware engineering solutions for ESC and heater technologies in 300mm wafer processing applications.
Role type
Director / MTS, Hardware Engineering (Semiconductor Equipment)
Builds
ESC assemblies, multi-zone embedded heater assemblies, and closed-loop temperature control systems for plasma processing chambers.
Domain
Semiconductor manufacturing equipment, ceramic engineering, thermal management
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
ESC design (JR/Coulombic), dielectric material selection, thermal modeling (FEA), closed-loop control systems, ceramic fabrication, plasma chemistry knowledge, failure analysis, electrical characterization, vacuum thermal management
Preferred skills
300mm tool qualification, high-purity ceramic techniques, reactive process chemistry familiarity, RF/DC power supply integration
Technologies
ANSYS, COMSOL, LCR meters, high-voltage testers, curve tracers, thermocouples, RTDs
Responsibilities
Design and develop ESC assemblies for 300mm wafer processing; Select and qualify dielectric materials for ESC ceramic layers; Define ESC clamping voltage, leakage current, and performance specifications; Characterize ESC electrical properties across process temperature ranges; Analyze and mitigate wafer backside contamination, particle generation, and arcing risks; Support ESC integration with RF bias and DC chucking power supplies; Design multi-zone embedded heater assemblies for uniform wafer temperature distribution; Perform thermal modeling and simulation to optimize heater layout and power density; Develop and validate closed-loop temperature control systems; Characterize heater uniformity, ramp rates, and thermal response; Manage thermal stress and CTE mismatch between materials
Seniority
Director / MTS, hands-on IC with strategic oversight
