(Senior) Principal Engineer, Heaters and Electrostatic Chuck (ESC)
Core
Design and deliver hardware engineering solutions for ESC and heater technologies in 300mm wafer processing applications.
Role type
Senior IC hardware engineer (semiconductor capital equipment)
Builds
ESC assemblies, multi-zone embedded heater assemblies, and closed-loop temperature control systems for plasma processing chambers
Domain
Semiconductor manufacturing equipment, ceramic engineering, thermal management
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electrostatic clamping mechanisms (Coulombic and JR force models), ceramic materials and thin-film dielectric systems, thermal management in vacuum environments, FEA thermal simulation, electrical characterization of dielectrics, high-purity ceramic fabrication techniques, plasma processing system requirements, closed-loop temperature control systems, wafer-level temperature mapping, failure analysis
Preferred skills
reactive process chemistries (fluorine, chlorine plasmas), 300mm wafer processing tools, OEM component qualification processes
Technologies
ANSYS, COMSOL, LCR meters, high-voltage testers, curve tracers, thermocouple/RTD sensors, PID controllers
Responsibilities
Design and develop Johnsen-Rahbek and Coulombic-type ESC assemblies; Select and qualify dielectric materials for ESC ceramic layers; Define ESC clamping voltage, leakage current, and chucking/dechucking performance specifications; Characterize ESC electrical properties including volume resistivity, dielectric constant, and breakdown voltage; Analyze and mitigate wafer backside contamination, particle generation, and arcing risks; Support ESC integration with RF bias and DC chucking power supplies; Design multi-zone embedded heater assemblies for uniform wafer temperature distribution; Perform thermal modeling and simulation to optimize heater layout, power density, and zone configuration; Develop and validate closed-loop temperature control systems; Characterize heater uniformity, ramp rates, and thermal response; Manage thermal stress and CTE mismatch between heater, ceramic, and base plate materials
Seniority
Senior, hands-on IC
