Engineer, Field Process (Hillsboro, OR)
Core
Expand ASM's advanced film technologies at a customer site in Oregon by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes.
Role type
Field Process Engineer (Semiconductor Manufacturing)
Builds
Next-generation semiconductor manufacturing processes and hardware for customer fabs
Domain
Semiconductor manufacturing / Thin-film deposition
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin-film processing (ALD, PEALD, PECVD, Epitaxy, LPCVD), DOE design and execution, root-cause analysis (KT, FMEA, Ishikawa), NPI process transfer, vacuum techniques, metrology, statistical experiment interpretation
Preferred skills
ASM equipment experience, process optimization in pilot/HVM environments, customer-facing technical presentations, cross-functional collaboration
Technologies
ALD, PEALD, PECVD, Epitaxy, LPCVD, vacuum systems, metrology tools
Responsibilities
Lead introduction, qualification, and transfer of new processes to customer site; Design and execute on-site experiments with customers; Perform structured problem solving and root-cause analysis on process nonconformances; Support process transfer to high-volume manufacturing (HVM) fabs; Analyze baseline system and process performance against technology-node requirements; Document key learnings and ensure knowledge transfer to local teams
Seniority
Mid-level, hands-on IC
