Engineering Technician II, Field Service
Core
Install, maintain, troubleshoot, and repair advanced semiconductor capital equipment in customer manufacturing environments.
Role type
Field Service Technician II (semiconductor capital equipment)
Builds
Semiconductor manufacturing equipment uptime and performance for chip fabrication customers
Domain
Semiconductor manufacturing / Capital equipment maintenance
Deliverable
physical/clinical work
Required skills
Troubleshooting microprocessor-controlled electro-mechanical systems, Reading electrical/electronic/electro-mechanical schematics, Preventative maintenance and repairs, System diagnostics, Operating oscilloscopes and DVMs, Interpreting technical documentation
Preferred skills
Experience with wafer fabrication environments, Knowledge of vacuum systems and gas control, RF-induced plasma technology experience, Robotics and motion control familiarity, Root-cause analysis techniques
Technologies
Microprocessor-based controllers, Vacuum systems, Gas control systems, RF plasma systems, Robotics, Motion control systems
Responsibilities
Perform installation, qualification, preventative maintenance, and remedial repair on complex semiconductor equipment; Troubleshoot electrical, electronic, mechanical, and software issues in customer facilities; Interpret schematics and drawings to diagnose equipment failures; Document service activities and technical findings; Collaborate with engineering and customer teams to resolve complex issues; Adhere to safety procedures in semiconductor manufacturing environments; Travel domestically and internationally (25–75%) to support customers