Principal Engineer, Electrical Engineering – Advanced Packaging
Core
Define, design, and govern the electrical architecture of advanced semiconductor packaging equipment (etch, deposition) to ensure system-level design excellence and compliance.
Role type
Principal Electrical Engineer (Semiconductor Capital Equipment)
Builds
Advanced packaging semiconductor tools (etch, deposition)
Domain
Semiconductor manufacturing equipment / Electrical Engineering
Deliverable
production ML models | product features | infrastructure
Required skills
Electrical system architecture, RF systems, motion control, power distribution, safety systems, requirements management, FMEA, root cause analysis, technical leadership
Preferred skills
Advanced packaging tools, PLCs, real-time control systems, certification, field issue resolution, product architecture influence
Technologies
PLC, RF, mixed-signal electronics
Responsibilities
Define and own electrical system architecture including power distribution, grounding, EMC/EMI, controls, and safety systems; Develop and decompose electrical requirements for subsystems; Lead system and electrical design reviews; Ensure compliance with SEMI, CE/UL, EMC, and safety regulations; Collaborate with systems and process engineering; Lead root cause analysis of electrical and electromechanical issues; Drive DFMEA/FMEA, reliability analysis, and risk mitigation; Mentor engineers and establish best practices; Support product roadmap planning and innovation.
Seniority
Principal, technical leader & mentorship
