Principal Engineer, Systems Engineering (Systems and Mechanical Engineering – Electrostatic Chuck (ESC))
Core
Lead the design and delivery of hardware engineering solutions for Electrostatic Chuck (ESC) and heaters technology, focusing on innovative semiconductor processing equipment.
Role type
Principal Systems and Mechanical Engineer (ESC hardware)
Builds
ESC and heaters hardware platforms and modules for semiconductor processing
Domain
Semiconductor manufacturing equipment / Hardware engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Hardware engineering, Material science (AlN, Al2O3, SiC, C22 alloys), Clamping mechanisms, Thermal engineering, Vacuum and plasma physics, Mechanical design, Manufacturing processes, System thinking
Preferred skills
R&D experience, Fab equipment familiarity, Supplier management, Innovation mindset, Long-term planning
Technologies
AlN, Al2O3, SiC, C22 alloys
Responsibilities
Lead design and development of ESC and heaters hardware platforms; Ensure timely delivery of component designs including safety and documentation; Drive new technology exploration and process development; Manage engineering projects to meet deliverables, quality, budget, and timing; Collaborate with universities and research institutes for breakthrough solutions; Motivate R&D and patent creation
Seniority
Principal, hands-on IC with strategic oversight