Senior / Principal Engineer, Software Engineering
Core
Designing and leading software for advanced semiconductor packaging and hybrid bonding equipment, integrating robotics, motion control, and thermal systems.
Role type
Senior / Principal Software Engineering Lead (Semiconductor Equipment)
Builds
Advanced packaging and hybrid bonding equipment software for semiconductor manufacturing
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features
Required skills
C++, software architecture, software baseline management, release planning, cross-functional collaboration, team mentorship, project management, Jira, Git
Preferred skills
Semiconductor process equipment industry experience, exposure to CoWoS/SoIC/InFO flows, handling multiple concurrent projects
Technologies
C++, Jira, Git
Responsibilities
Define software development plans and roadmaps for advanced packaging solutions; Lead end-to-end software development with focus on quality; Drive software architecture decisions; Plan and execute multiple software baselines; Collaborate with hardware and process engineering teams; Build and mentor software engineering teams
Seniority
Senior / Principal, hands-on IC with leadership