(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging
Core
Lead development of high-thermal-conductivity thin films and materials for next-generation high-performance computing (HPC) and advanced packaging, enabling heterogenous integration.
Role type
Senior IC process engineering leader (thermal materials & advanced packaging)
Builds
High-thermal-conductivity thin films, material stacks, and process solutions for advanced logic, foundry, and memory devices
Domain
Semiconductor manufacturing / Advanced Packaging / Thermal Management
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process technology development, Thin-film deposition (ALD/PEALD, CVD/PECVD), Materials science, Process optimization, Customer technical leadership, Hardware collaboration
Preferred skills
High-thermal-conductivity material expertise, RF/microwave deposition, Patent/publication generation, Thought leadership in thermal management
Technologies
ALD, PEALD, CVD, PECVD, RF, Microwave
Responsibilities
Lead process development team for thermal films, Define material roadmaps aligned to customer specs, Optimize deposition processes for rate/uniformity/properties, Collaborate with hardware teams on integration schemes, Partner with global R&D on new materials, Communicate technical solutions to end customers
Seniority
Senior, hands-on IC with leadership responsibilities