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Principal Field Process Engineer

OR Hillsboro Of(ASM America Inc.)💼 Full-time🗓 2026-07-06 → 2026-09-26

Core

Senior individual contributor serving as technical authority for customer-facing process applications, leading NPI, on-site process development, and HVM transfers for advanced deposition processes.

Role type

Principal Field Process Engineer (Senior IC)

Builds

Advanced deposition processes and hardware (thermal ALD, plasma ALD, Area Selective Deposition) for semiconductor manufacturing

Domain

Semiconductor manufacturing / Thin-film deposition

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Thin-film deposition (ALD), semiconductor device integration, vacuum systems, film metrology, structured problem solving, DOE-based experiment design, cross-functional escalation management

Preferred skills

ASM ALD/PEALD/PECVD/Epitaxy/Vertical Furnace LPCVD equipment experience, deposition process optimization, customer-facing technical discussions, cross-functional action plan coordination

Technologies

Thermal ALD, Plasma ALD, Area Selective Deposition, PEALD, PECVD, Epitaxy, Vertical Furnace LPCVD

Responsibilities

Own technical delivery and escalation for NPI of advanced deposition processes and hardware; Lead complex troubleshooting, root cause analysis, and cross-functional resolution with customers and field teams; Drive on-site process and hardware development including DOE-based experiments; Lead process transfer to HVM fabs and develop/transfer Best Known Methods (BKMs); Capture and feedback technical learnings to influence future hardware and process packages

Seniority

Principal, hands-on IC with strategic customer interface

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