Board Support Package (BSP) Firmware Engineer
Core
Own the complete Board Support Package (BSP) lifecycle for next-generation consumer wearable devices, powering up prototypes and enabling new SoC silicon.
Role type
Senior IC embedded firmware engineer (BSP)
Builds
Robust software platforms for consumer electronics wearables and AI devices
Domain
Consumer electronics / Embedded systems / Wearables
Deliverable
production ML models | product features
Required skills
C for embedded systems, ARM assembly, embedded Linux (Yocto/Buildroot), device tree, kernel device drivers, RTOS (Zephyr/FreeRTOS), board bring-up, driver development (I2C/SPI/UART/USB/MIPI), bench instrument usage
Preferred skills
Consumer wearable firmware delivery, camera subsystem tuning, low-power wireless coexistence, audio pipelines, battery fuel gauging, platform security flows, NPI at contract manufacturers, hardware-in-the-loop testing
Technologies
ARM SoCs, Yocto, Buildroot, Zephyr, FreeRTOS, MIPI CSI-2, Bluetooth, BLE, Wi-Fi, I2S, PDM, SoundWire, JTAG, SWD
Responsibilities
Lead board bring-up for new hardware including power sequence and clock initialization; Develop, port, and maintain BSP components like bootloaders and device drivers; Enable and validate core wearable subsystems (PMIC, sensors, wireless, audio, display); Build and maintain diagnostic tooling and firmware update mechanisms; Interface with SoC and component vendors to resolve errata and integrate reference code; Support EVT/DVT/PVT and mass production builds; Provide cross-functional support for board-level debugging; Produce comprehensive documentation for bring-up procedures and driver interfaces
