Field Service Engineer- "I & II"
Core
Install, maintain, repair, and troubleshoot advanced semiconductor equipment at customer fab sites to ensure peak performance and safety.
Role type
Field Service Engineer (IC)
Builds
Semiconductor capital equipment for wafer fabs
Domain
Semiconductor manufacturing / Capital Equipment
Deliverable
physical/clinical work
Required skills
electromechanical engineering, reading schematics, structured troubleshooting, root-cause analysis, cleanroom safety protocols, tool architecture knowledge, MS Office
Preferred skills
wafer fab operations, robotics, vacuum systems, plasma, gas handling, RF, beta-site support, procedure documentation, customer escalations
Technologies
semiconductor equipment, vacuum systems, plasma systems, gas handling systems, RF systems
Responsibilities
Install and maintain semiconductor tools at customer sites, troubleshoot complex tool and process issues, perform root-cause analysis, provide training to less-experienced engineers, document service activities and update procedures, manage customer engagements and escalations
Seniority
Entry to Mid-level (Engineer I: 1-3 years; Engineer II: 4+ years or Master's)