HVM Field Process Engineer – PEALD, PECVD
Core
On-site process expert optimizing PEALD and PECVD deposition processes for next-generation semiconductor manufacturing at customer HVM fabs.
Role type
Field Process Engineer (PEALD/PECVD)
Builds
Deposition processes for semiconductor chips enabling 5G, cloud computing, AI, and autonomous driving
Domain
Semiconductor manufacturing / Chemical Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PEALD/PECVD process optimization, vacuum systems, metrology, DOE design, root-cause analysis, HVM fab experience
Preferred skills
ASM tool experience, film quality improvement, tool-to-tool matching
Technologies
XP8 DCM/QCM platforms, PEALD, PECVD
Responsibilities
Lead process qualification and optimization during tool installs and ramp-up, Execute structured DOEs to improve film quality and throughput, Troubleshoot process issues using systematic root-cause analysis, Partner with customer and ASM teams to drive continuous improvement, Document findings and share learnings across global teams, Build strong technical relationships with customer engineers
Seniority
Mid-Senior, hands-on IC
