Senior Engineer, Process Engineering (Advanced Packaging)
Core
Senior R&D engineer translating PhD research into scalable semiconductor process technologies for advanced packaging.
Role type
Senior IC process engineer (advanced packaging)
Builds
Next-generation semiconductor devices and chips
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Thin-film deposition (ALD, PECVD, PVD, ECP), DOE-based experiment design, materials and process characterization, data analysis, electro/mechanical equipment operation
Preferred skills
Advanced packaging/interconnects research, statistical methods/DOE tools, materials characterization (SEM, TEM, XRD, ellipsometry), cross-disciplinary collaboration
Technologies
ALD, PECVD, PVD, ECP, SEM, TEM, XRD, ellipsometry
Responsibilities
Contribute to R&D and optimization of semiconductor processes; Design, execute, and analyze experiments using DOE; Perform materials and process characterization; Analyze data and document results; Collaborate with cross-functional R&D and process teams; Support troubleshooting in lab and pilot environments; Participate in technology reviews and process improvement initiatives
Seniority
Senior, hands-on IC
