Sr Engineer, APTD Data Integration
Core
Data integration engineer driving AI transformation and integrated solutions for Advanced Packaging Technology (APTD) to accelerate HBM product development.
Role type
Senior IC data integration engineer (AI/ML focus)
Builds
Integrated data solutions, automated ETL/analytics jobs, visualization reports for HBM product development
Domain
Semiconductor manufacturing / Advanced Packaging Technology
Deliverable
production ML models
Required skills
Generative AI & foundation models, Cloud platforms (GCP/AWS/Azure), Database management (Oracle/MSSQL/Snowflake), Python/C#/Matlab/R, Data visualization (Tableau/Power BI), ETL development, Cross-functional collaboration
Preferred skills
Semiconductor Device Physics, Fabrication, Assembly and Test knowledge
Technologies
OpenAI, Anthropic Claude, Google Gemini, Microsoft Azure AI, GCP, AWS, Azure, Oracle, MSSQL, Snowflake, Tableau, Power BI, Python, C#, Matlab, R
Responsibilities
Work cross-functionally with PIE, PE, MRDA, IT, Smart Manufacturing, Process Control, and Equipment teams; Drive AI transformation by implementing generative AI solutions; Extract, monitor, and analyze inline/test data to improve yield and performance; Develop prototype solutions including automated ETL and analytic jobs; Summarize complex problems and drive team execution with defined milestones
