Silicon Product Integration
Core
Lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs, serving as the technical bridge between HP, foundry partners, design teams, and manufacturing organizations.
Role type
Senior IC product engineer (silicon/MEMS)
Builds
Next-generation MEMS products
Domain
Semiconductor manufacturing / MEMS
Required skills
Semiconductor foundry experience, Product Engineering, Yield Engineering, Process Integration, Device Engineering, Failure Analysis, NPI execution, Cross-functional program leadership, Technical decision-making
Preferred skills
MEMS development experience, High-volume manufacturing launch experience, Wafer foundry partner management, Complex technical program management
Technologies
MEMS, Wafer Foundry, Advanced Packaging
Responsibilities
Own silicon product engineering activities across development, qualification, ramp, and sustaining phases; Drive structural cost saving initiatives in wafer Foundry and advanced packaging factories; Lead NPI silicon builds and ensure timely execution of deliverables; Partner with design, architecture, reliability, systems, and manufacturing teams to close technical issues; Drive issue resolution and technical solutions for process marginality and escalation; Serve as the primary technical interface with internal/external foundries and technology partners; Lead root-cause investigations and corrective actions related to yield, reliability, and manufacturability; Develop and manage technical schedules, milestones, dependencies, and risk mitigation plans for strategic MEMS programs.
