Metallization engineering lead
Core
Lead semiconductor process/equipment engineering teams to drive manufacturing excellence, yield improvement, and operational stability in wafer fab environments.
Role type
Senior Process/Equipment Engineering Lead (Semiconductor)
Builds
High-volume memory and storage manufacturing lines (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Wafer Fab
Deliverable
production ML models
Required skills
Semiconductor process/equipment engineering, team leadership, yield management, SPC, process control, equipment reliability, cross-functional collaboration, data-driven decision making
Preferred skills
Advanced node experience, high-volume manufacturing (HVM), ramp-up/new site expansion, automation/data analytics/smart manufacturing
Technologies
SPC tools, process control systems, AI-assisted tools
Responsibilities
Lead and develop a team of process/equipment engineers to support high-volume manufacturing, Drive process stability, yield improvement, and equipment performance, Own and execute continuous improvement initiatives (yield / cycle time / cost), Collaborate cross-functionally with production, quality, IE, and global teams, Make data-driven decisions and take accountability for line performance, Coach and mentor team members to grow technical and leadership capabilities, Support new technology transfer / ramp-up / site expansion
Seniority
Senior, hands-on IC with leadership responsibilities