Engineering Director - AI/Wireless Module Design
Core
Lead a team of RF, baseband, software, and test engineers to design next-generation AI and 5G/6G modules for robotics, IoT, automotive control, and industrial automation.
Role type
Senior IC Engineering Director (Wireless Module Design)
Builds
AI modules, 5G/6G modules
Domain
Hardware Engineering, Wireless Communications, IoT, Automotive
Deliverable
product features
Required skills
RF design, Baseband design, Hardware design (concept to mass production), Design for manufacturing, Thermal mitigation, Miniaturization, Regulatory certification, CAD, ME, PDN/PSIG collaboration, Global team leadership
Preferred skills
None stated
Technologies
None stated
Responsibilities
Translate ill-defined product requirements into proposals with cost and time-to-market considerations; Identify and conduct research on future module improvements; Lead the team to stay ahead of competition and improve products
Seniority
Director, hands-on IC with team leadership
