CareerPlan

Director of Engineering

Hsinchu City, Hsinchu City, TaiwanFull-time2026-11-04 → 2026-11-10

Core

Lead a team of engineers to design next-generation AI modules and 5G/6G modules for robotics, IoT, automobile control, and industrial automation.

Role type

Director of Hardware Engineering

Builds

AI modules, 5G/6G modules

Domain

Semiconductor, Wireless Communications

Deliverable

production ML models

Required skills

RF design, baseband design, hardware design for manufacturing, thermal mitigation, miniaturization, regulatory certification, global team leadership

Preferred skills

cost and time-to-market optimization, product proposal development, competitive analysis

Technologies

RF, baseband, CAD, ME, PDN/PSIG

Responsibilities

Translate ill-defined product requirements into proposals with cost and time-to-market considerations; identify and research future module improvements; lead the team to stay ahead of competition and improve products

Seniority

Director, strategic leadership & hands-on technical direction