Sr. Staff Engineer, Thermal - AI Compute
Core
Lead thermal architecture solutions, simulation, validation, and optimization for Qualcomm's Dragonfly™ AI300 platform and future AI computing platforms to enable industry-leading performance, efficiency, and reliability.
Role type
Senior Staff Thermal Engineer (AI Compute)
Builds
Thermal architecture and validation for high-power AI accelerators and data center platforms
Domain
Semiconductor packaging and thermal management for AI/HPC
Deliverable
production ML models
Required skills
Computational fluid dynamics (CFD), thermal simulation, thermal testing and validation, thermal architecture design, cross-functional technical leadership, data analysis scripting
Preferred skills
High-performance computing cooling, liquid/air/hybrid cooling technologies, advanced semiconductor packaging (2.5D/3D), Python/C/C++/MATLAB, thermal interface materials, heat spreaders/vapor chambers/heat pipes
Technologies
ANSYS Icepak, Celsius EC, Flotherm, Python, C/C++, MATLAB
Responsibilities
Lead thermal architecture solutions through simulation and test; Perform thermal simulations utilizing CFD tools from silicon to data center environment; Drive direction and strategy discussions and conduct thermal design reviews; Conduct thermal tests to validate/characterize models; Analyze and document simulation and test results
Seniority
Senior Staff, hands-on IC with strategic influence
