Staff Engineer, Thermal
Core
Lead thermal architecture solutions and drive strategy for high-performance AI computing platforms (Dragonfly™ AI300) to enable industry-leading performance, efficiency, and reliability.
Role type
Staff/Principal Thermal Engineer (AI/HPC)
Builds
Thermal architecture, simulation models, and validation for AI accelerators and data center systems.
Domain
Semiconductor packaging, AI computing, high-performance computing (HPC), data center cooling.
Deliverable
production ML models
Required skills
Thermal architecture design, CFD analysis, thermal simulation, thermal testing & validation, cross-functional technical leadership, trade-off analysis, technical documentation.
Preferred skills
High-power processor/GPU/AI accelerator cooling, advanced packaging (2.5D/3D), thermal interface materials (TIMs), heat pipes/vapor chambers, Python/C/C++/MATLAB scripting, lab instrumentation.
Technologies
ANSYS Icepak, Celsius EC, Flotherm, Python, C/C++, MATLAB.
Responsibilities
Lead thermal architecture solutions through simulation and test; Perform thermal simulations utilizing CFD tools from silicon to data center environment; Drive direction and strategy discussions and conduct thermal design reviews; Conduct thermal tests to validate/characterize models; Analyze and document simulation and test results.
Seniority
Staff/Principal, hands-on IC with strategic influence.
