Mechanical Engineering Internship – Summer 2027
Core
Design, simulate, and test mechanical and thermal systems supporting Qualcomm's advanced semiconductor technologies, including IC packaging, chip/package co-design, and next-generation cooling solutions.
Role type
Mechanical Engineering Intern
Builds
Mechanical and thermal systems for semiconductor technologies
Domain
Semiconductors / Hardware Engineering
Required skills
Python, Matlab, Solid Mechanics, Mechanics of Materials, Finite Element Analysis (FEA), thermal system design, heat transfer, mechanical design, microelectronics
Preferred skills
Cadence Sip, AutoCAD, Solidworks, IC packaging structures, chip-package interaction, electronic packaging processes, Computational Fluid Dynamics (CFD), wind tunnel operation, airflow bench operation, heatsink design methodology, server product design, system impedance testing, fan performance measurement
