CareerPlan

Multimedia Engineering Internship – Summer 2027

San Diego, California, United States of AmericaInternship2026-09-18 → 2026-11-10

Core

Work on system-level architecture, analysis, budgeting, and optimization of multimedia use cases (camera, video, audio, speech, GPU, modem, CPU) to achieve lowest power and best performance for Snapdragon devices.

Role type

Multimedia Engineering Intern

Builds

Power- and performance-efficient multimedia technologies for Snapdragon devices

Domain

Consumer electronics, mobile computing, multimedia systems

Required skills

C, C++, Python, system-level architecture, HW/SW co-design

Preferred skills

OpenCL, compilers, ray tracing, GPU, Vulkan/DX, DNNs, motion, AR/XR, depth, linear algebra, perception, image/video segmentation, 3D, pattern recognition, image/video processing, acoustics, TTS, speech/audio signal processing, compression, digital signal processing, machine learning frameworks (TensorFlow, PyTorch), deep learning, neural networks, signal processing, Matlab

Technologies

Snapdragon, OpenCL, Vulkan, DX, TensorFlow, PyTorch, Matlab, C, C++, Python

Responsibilities

System-level architecture and analysis of multimedia use cases; Optimization for power and performance; HW/SW co-design

Seniority

Intern