Staff Failure Analysis Engineer - Advanced Packaging Technologies
Core
Lead the development and enablement of FA test interfaces, advanced socketing, and thermal management solutions to support Electrical Fault Isolation (EFI) for Qualcomm's diverse product portfolio.
Role type
Staff Failure Analysis Engineer (Hardware)
Builds
Custom sockets, carrier boards, and thermal management solutions for FA testing environments.
Domain
Semiconductor hardware engineering / Advanced packaging
Required skills
Hardware design, FA test interface enablement, socketing technologies, thermal management solutions, electrical analysis, hardware specifications, cross-functional collaboration
Preferred skills
Hands-on hardware design experience, signal integrity knowledge, complex SoC support, thermal analysis techniques
Technologies
ATE-based testing, platform-based testing, Silicon on Dock (SOD), high-TDP devices
Responsibilities
Lead FA test interface enablement across Mobile, Compute, Automotive, Networking, and AR/VR platforms; Proactively plan, develop, and deploy FA-specific hardware such as custom sockets and carrier boards; Define and optimize socket and interface variants for FA test scenarios; Design, evaluate, and deploy thermal management solutions for high-power devices; Utilize thermal and electrical analysis tools to assess performance and reliability; Develop detailed hardware specifications and collaborate with internal teams and suppliers; Partner with Design, Product Engineering, Yield, and Reliability teams; Continuously evaluate emerging technologies and packaging trends.
Seniority
Staff, hands-on IC
