FY27 Intern - Engineering Internship 2027 - 6 months, Cork
Core
Engineering intern supporting Digital, Analog, and Embedded Software Design & Verification teams developing cutting-edge IP for Snapdragon chipsets.
Role type
Engineering Intern (VLSI/Embedded Software)
Builds
IP for CPU, AI, encryption, graphics, and high-speed connectivity on 5nm and below FinFET silicon nodes.
Domain
Semiconductor / VLSI / Embedded Systems
Required skills
Verilog, VHDL, C/C++, Python, Tcl/Perl/shell-scripting, FPGA design, Low Power Design, Analog Integrated Circuits, wireless/wired communications protocols, ARM processors, security algorithms
Preferred skills
Coursework in Circuits and Electronics, Signals and systems, Microelectronic Devices, Semiconductor Devices, Digital Integrated Circuits, Digital Signal Processing, Low power VLSI, Semiconductor Physics, Software Programming
Technologies
FinFET, 5nm, FPGA, ARM, Windows, Office, Visio
Responsibilities
Work directly with architecture, software, measurement, and SoC teams; complete assigned tasks on design, coding, and scripting for advanced CMOS processes.
Seniority
Intern
