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HVM ME Equipment Engineer

Boise, Idaho, United States of AmericaFull-time2026-09-15 → 2026-10-16

Core

Hands-on equipment engineer monitoring, maintaining, and upgrading semiconductor manufacturing tools to guarantee flawless functionality and optimize fab performance.

Role type

Senior IC equipment engineer (semiconductor manufacturing)

Builds

High-volume memory and storage manufacturing equipment uptime and yield

Domain

Semiconductor manufacturing / Memory and storage

Required skills

Semiconductor equipment engineering, mechanical aptitude, AC/DC circuits, electronic components, electrical systems, vacuum systems, gas flow systems, mechanical fundamentals, SPC principles, Design of Experiment (DOE), 8D problem solving, chemical handling, Python, Java, Tableau, Matlab

Preferred skills

Understanding of fab process areas, equipment architecture, fast-paced fab environment collaboration, Agentic AI workflows

Technologies

Python, Java, Tableau, Matlab, MS Office Suite

Responsibilities

Resolve yield loss, excursions, defects, tool restrictions, or output loss and drive root cause analysis; Improve area/shift KPIs by driving Long Term Down (LTD) reductions and Manufacturing Availability (MA) improvements; Drive a culture of Total Productive Maintenance (TPM); Analyze data with SPC principles to improve process controls; Apply DOE principles and/or 8D problem solving to identify equipment issues; Accurately handle chemicals and associated hazards in the work area.

Seniority

Mid-level, hands-on IC