CareerPlan

Senior Process Integration Engineer

Boise, Idaho, United States of AmericaFull-time2026-09-15 → 2026-11-10

Core

Lead integration efforts to transfer and scale advanced DRAM nodes into high-volume production at a new fabrication facility, resolving complex process interactions to drive yield, cost, and quality improvements.

Role type

Senior IC process integration engineer (semiconductor manufacturing)

Builds

Advanced DRAM memory products for global markets

Domain

Semiconductor manufacturing / Memory technology

Required skills

Root cause analysis, DOE design and execution, yield ramp management, cross-functional coordination, transistor operation knowledge, device scaling, reliability analysis, data analysis, problem-solving methodologies

Preferred skills

DRAM integration experience, 300mm environment scale-up, FMEA, 8D, SPC, FDC methodologies, technology transfer leadership

Technologies

DOE, FMEA, 8D, SPC, FDC, 300mm fab equipment

Responsibilities

Lead module ownership including root cause analysis and failure investigation; Drive yield, cost, and quality improvements using data-driven methodologies; Develop and execute DOE to improve process capability, margin, and stability; Lead technology transfer and yield ramp from TD or HVM fabs; Coordinate cross-functional teams to qualify processes, tools, and materials

Seniority

Senior, hands-on IC