HBM PROCESS ENGINEER(FY28 NCG)
Core
Leverage AI and advanced analytics to identify process variation, uncover hidden KPIVs, and accelerate root cause analysis in semiconductor manufacturing. (via careerplan.io/jobs/44498006-hbm-process-engineerfy28-ncg-at-micron)
Role type
Senior IC HBM Process Engineer (AI-enabled manufacturing)
Builds
High-performance memory and storage solutions (DRAM, NAND, NOR) for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing (Backend/Assembly) + Artificial Intelligence
Deliverable
production ML models
Required skills
Machine learning, pattern recognition, large-scale manufacturing data analysis, digital twin modeling, predictive maintenance, AI-assisted experiment design, data mining, knowledge management, root cause analysis, process optimization
Preferred skills
Semiconductor assembly or backend processes experience, Lamination, Lapping/Grinding, and Laser Dicing processes knowledge
Technologies
Copilot, Power BI, AI Agents, dashboards, digital twins, AI-based early warning systems
Responsibilities
Develop and deploy AI-assisted monitoring, anomaly detection, and predictive models; Utilize digital solutions to automate routine engineering analysis and reporting; Partner with Automation, IT, and Data Science teams to implement smart manufacturing solutions; Establish and maintain digital twins and predictive maintenance models; Identify opportunities to reduce engineering cycle time through AI-assisted tools; Lead AI adoption initiatives within the manufacturing organization
Seniority
Mid-level (2 years experience), hands-on IC