Engineer Lead/MGR , Tainan Manufacturing Section Manager
Core
Lead high-volume semiconductor frontend manufacturing operations, bridging production and engineering to drive efficiency, quality, and operational excellence.
Role type
Senior IC manufacturing operations manager
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing (frontend wafer fab)
Required skills
Semiconductor wafer fabrication process knowledge, high-volume manufacturing operations, team leadership, shift management, WIP management, continuous improvement (Lean/Six Sigma), data-driven decision making, AI tool fluency
Preferred skills
Multinational semiconductor company experience, DRAM/advanced node manufacturing, fab KPI management, cross-functional alignment with PE/EE
Technologies
AI-assisted tools, data analytics platforms
Responsibilities
Lead daily wafer fabrication operations to meet output and delivery targets, manage and develop production teams in cleanroom environment, monitor and drive manufacturing KPIs (WIP, cycle time, OEE), support process control and root cause analysis, optimize fab capacity and resource allocation, drive cycle time improvement and productivity enhancement initiatives
Seniority
Senior, hands-on IC with leadership responsibilities