Engineer/Associate Engineer – AI & Automation Engineer
Core
Develop AI/ML models and automation tools to accelerate semiconductor package design, simulation, and validation workflows.
Role type
Associate Engineer (AI & Automation in Semiconductor Packaging)
Builds
Scalable digital solutions including AI/ML models, engineering assistants, copilot agents, dashboards, and data pipelines for design optimization and anomaly detection.
Domain
Semiconductor manufacturing / AI & Machine Learning (via careerplan.io/jobs/44146168-engineerassociate-engineer-ai-automation-engineer-at-micron)
Deliverable
production ML models
Required skills
Engineering mathematics, physics, problem solving, data interpretation, Python, MATLAB, C/C++, semiconductor packaging concepts, design methods, manufacturing processes, engineering systems
Preferred skills
Semiconductor packaging exposure, simulation exposure, AI/ML solutions experience, generative AI usage, data analytics and visualization, PLM/ALM exposure
Technologies
Python, MATLAB, C/C++, CAD/EDA tools, Teamcenter
Responsibilities
Support package feasibility studies, architecture evaluations, and design optimization; Create and analyze package layouts, substrate structures, and stack-ups using CAD/EDA tools; Develop automation for repetitive design, simulation, and data-processing activities; Build or contribute to AI/ML models for design validation, optimization, and prediction; Collaborate with global teams across product engineering, technology development, and manufacturing.
Seniority
Associate, hands-on IC
