Technical Program Manager III - 6322
Core
Drive hardware program execution for next-generation AR wearable devices, managing PCB development and electrical component integration from design through production.
Role type
Senior Technical Program Manager (Hardware/PCB)
Builds
PCBs (flex circuits, multi-layer boards), SMT builds, FATP builds for AR wearables
Domain
Consumer electronics / Hardware engineering / AR devices
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PCB development lifecycle management, SMT and FATP build management, cross-functional team leadership, electrical engineering collaboration, global team coordination, risk mitigation, hardware design release ownership
Preferred skills
AR wearable device development, signal integrity (SI/PI) knowledge, compact form factor integration, contract manufacturer ecosystem experience
Technologies
SMT, FATP, flex circuits, multi-layer boards (MLBs)
Responsibilities
Lead end-to-end program management of PCB development from design through production; Drive design release processes ensuring alignment across electrical engineering and layout teams; Manage SMT and FATP builds optimizing for schedule, quality, and yield; Collaborate with electrical and layout engineers to refine circuit designs for compact wearables; Track program schedules, dependencies, and risks; Coordinate with APAC-based teams and vendors
Seniority
Senior, hands-on IC