Films Process Development Engineer
Core
Develop and own advanced thin-film deposition processes for next-generation semiconductor technologies, translating device requirements into manufacturable solutions.
Role type
Staff Thin Film Process Development Engineer (Semiconductor)
Builds
Next-generation memory and storage solutions
Domain
Semiconductor manufacturing / Materials science
Required skills
Thin-film deposition (CVD, PECVD, ALD, PEALD), DOE design, root-cause analysis, process integration, cross-module collaboration, data-driven decision-making
Preferred skills
Dielectric/hard-mask/etch-selective film development, process flow integration, advanced characterization (XPS, AFM, TEM/SEM, SIMS), AI-assisted analytics
Technologies
CVD, PECVD, ALD, PEALD, XPS, AFM, XRD, AES, ellipsometry, TEM, SEM, EBSD, SIMS
Responsibilities
Develop and optimize thin-film deposition processes; Translate device requirements into film properties and process specs; Design and implement experiments to identify process mechanisms and defects; Establish relationships between process conditions and electrical performance/yield; Drive thin-film concepts from feasibility to integration; Partner with patterning, etch, metrology, and equipment teams; Evaluate new deposition technologies and materials; Provide technical leadership and mentor engineers
Seniority
Staff, technical leadership & hands-on IC