CareerPlan

Staff Engineer Lead, PCVD Equipment

Boise, Idaho, United States of AmericaFull-time2026-08-18 → 2026-11-10

Core

Lead a team of equipment engineers to improve manufacturing capability, yield, throughput, and quality in semiconductor fabrication.

Role type

Senior IC equipment engineering lead (semiconductor manufacturing)

Builds

Semiconductor memory and storage solutions (DRAM)

Domain

Semiconductor manufacturing / Equipment engineering

Required skills

People leadership, semiconductor manufacturing processes, equipment engineering, operational excellence, project management, technical problem solving, resource allocation, strategic planning, cross-functional collaboration

Preferred skills

Leading large engineering organizations, talent development, AI-enabled tools, machine learning, automation platforms, advanced data analytics, anomaly detection

Technologies

AI-enabled tools, machine learning, automation platforms, advanced data analytics

Responsibilities

Lead and develop a team of equipment engineers to achieve manufacturing, quality, output, and cost objectives; Define team strategy, establish performance goals, and allocate resources; Drive equipment optimization initiatives to enhance yield, throughput, and operational efficiency; Partner with global teams to implement best-known methods and support equipment projects; Communicate technical and business updates to leadership and multi-functional audiences

Seniority

Senior, hands-on IC with people leadership