CareerPlan

CMP Process Development R&D Engineer

Boise, Idaho, United States of AmericaFull-time2026-09-18 → 2026-11-10
On-site

Core

Develop and optimize Chemical Mechanical Planarization (CMP) processes for semiconductor wafers to meet physical and electrical product requirements.

Role type

Staff IC process development engineer (CMP)

Builds

CMP processes for 300mm semiconductor wafers

Domain

Semiconductor manufacturing / Materials Science

Required skills

CMP process development, failure analysis (FMEA, 8D, SPC/FDC), root cause analysis, DOE, statistical process control, slurry/pad interaction understanding, FEOL/BEOL process knowledge, pilot line management, process transfer

Preferred skills

Dielectrics/metals CMP experience, electrical/probe failure understanding, solid-state device physics, defect analysis, AI/model-based problem solving, endpoint systems proficiency

Technologies

CMP tools, endpoint systems, 300mm wafer fab equipment

Responsibilities

Develop CMP processes, optimize for cost/variability/capability, conduct failure analysis, collaborate with integration teams, maintain pilot lines, support process transfer

Seniority

Staff, hands-on IC with strategic influence