PRINCIPAL ENGINEER - OCT FE PEE WET PROCESS
Core
Leading process optimization, yield improvement, and cost reduction in semiconductor wet process fabrication.
Role type
Principal Engineer, Semiconductor Wet Process
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing, Wet Process (SWC, Bench, Scrub, Backside, Bevel)
Required skills
Semiconductor equipment and process management, Failure analysis (FMEA, 8D, SPC), Process yield improvement, Cost reduction, Root cause analysis, Hardware CIP roadmap development, IoT sensor integration, AI tool application for operational tasks
Preferred skills
Cross-functional collaboration, Global site network engagement, Supplier management, Safety and sustainability standards adherence
Technologies
IoT sensors, AI-assisted tools, SPC methodology, FMEA, 8D
Responsibilities
Strategize and lead productivity, yield, quality, and cost improvement engagements; Collaborate with cross-functional teams for defect reduction and particle removal efficiency; Develop roadmap for process and hardware CIP implementation; Drive process and hardware improvement with emphasis on safety, defect reduction, and sustainability; Set up IoT sensors for defense line strengthening; Establish and improve process conditions and technology to reduce production costs; Integrate AI-assisted tools to improve efficiency and effectiveness.
Seniority
Principal, hands-on IC with strategic leadership