Engineer, HIG HBM
Core
Define and develop reliability test flows, plans, and strategies for HBM products; apply machine learning and AI tools to analyze reliability datasets, segment failures, and drive root cause resolution.
Role type
Reliability Engineer (HBM)
Builds
HBM memory products and qualification test flows
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Deliverable
production ML models
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), Machine learning (regression, classification, anomaly detection), Data analysis, Python scripting, CMOS technology knowledge, DRAM architecture understanding, Project management
Preferred skills
Semiconductor device experience, Circuit design experience, Product validation experience, AI/automation integration
Technologies
Python, JMP, Claude code, Agentic AI, EFA, PFA
Responsibilities
Define reliability stress test flows and plans; Manage qualification execution and gating issue resolution; Drive DPM reduction through optimized test strategies; Debug and resolve defectivity and intrinsic reliability issues; Provide recommendations for process conversions to improve yield and cost; Apply ML/AI to reliability datasets for fail segmentation; Collaborate with Fab, Design, and Quality teams.
Seniority
Mid-level, hands-on IC
