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Principal Engineer Lead - Track and Trim Equipment Dev

Boise, Idaho, United States of America💼 Full-time🗓 2026-06-16 → 2026-09-28

Core

Technical leader for photolithography Track and Trim systems, driving innovation in advanced semiconductor manufacturing and EUV capabilities.

Role type

Principal Engineer Lead (Semiconductor Equipment)

Builds

Next-generation lithography equipment and processes for high-volume manufacturing

Domain

Semiconductor / Photolithography / EUV

Required skills

Photolithography Track systems expertise, Equipment lifecycle management, Process strategy definition, High-volume manufacturing optimization, Vendor partnership, Safety protocols (PPE, LOTO)

Preferred skills

Lithography Edge Trim experience, EUV technology development, Advanced degree, Equipment performance improvement in HVM, Joint innovation with vendors

Technologies

EUV, Track and Trim systems, Semiconductor manufacturing tools

Responsibilities

Serve as SME for Track & Trim systems and define process strategy; Lead equipment lifecycle programs from selection to deployment; Improve tool uptime and performance to meet yield targets; Drive safety and operational perfection; Partner with multi-functional teams and vendors to scale solutions

Seniority

Principal, hands-on IC with strategic leadership

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