CareerPlan

Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Boise, Idaho, United States of AmericaFull-time2026-07-24 → 2026-11-10

Core

Guide HBM products through concept, build, NPI, and HVM phases by facilitating multi-functional life-cycle management and tactical progress.

Role type

Engineering Execution Manager (Product Development)

Builds

HBM memory products

Domain

Semiconductor / High Bandwidth Memory

Deliverable

product features

Required skills

Multi-functional team leadership, project prioritization, risk analysis, schedule development, cross-functional integration, hardware readiness assessment

Preferred skills

Data analysis and visualization, JIRA/Confluence proficiency, process improvement mindset

Responsibilities

Integrate HBM development across extended teams and partners; Partner with Technology, Build, Process, and Manufacturing teams; Collaborate with PMO to build development schedules; Communicate development status and priorities; Set tactical expectations; Serve as product point of contact; Consolidate inputs for hardware readiness.

Seniority

Manager, hands-on IC