CareerPlan

F15 ADTJ PI Device Engineer

Hiroshima, JapanFull-time2026-09-09 → 2026-10-23
Based in Japan

Core

Optimizing device performance and yield in high-volume DRAM manufacturing by balancing process integration conditions and repair density consumption.

Role type

Senior Process Integration Engineer (Device)

Builds

High-volume DRAM memory chips

Domain

Semiconductor manufacturing (DRAM)

Required skills

Semiconductor process engineering, Data analysis, Statistics, Cross-functional collaboration, Root-cause analysis, Corrective/preventive actions, SWR creation, PCRB management

Preferred skills

Yield improvement, Defect analysis, Metrology analysis, SPC, Structured problem solving

Technologies

SPC, Metrology tools

Responsibilities

Create SWRs for device performance improvement, Balance process integration and device performance conditions, Proceed with PCRB using data summaries, Collaborate with PE/GQ/Design/TD teams and other sites