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Photolithography Process Development Engineer

Boise, Idaho, United States of AmericaFull-time2026-01-29 → 2026-10-16

Core

Develop manufacturing-friendly photolithography processes for next-generation DRAM storage devices, including 365, 248, and 193 immersion lithography.

Role type

Senior IC process development engineer (photolithography)

Builds

Next-generation DRAM memory devices

Domain

Semiconductor manufacturing / Photolithography

Deliverable

production ML models

Required skills

Photolithography process development, Immersion lithography principles, Chemical process knowledge (365/248/193nm), Optics understanding, Data analysis, Root cause analysis, Material characterization

Preferred skills

Data science, Programming, Photolithography simulation software

Technologies

365nm, 248nm, 193nm immersion lithography scanners

Responsibilities

Lead modules within next-generation storage devices, Innovate design and layout techniques, Correlate device failure with process conditions using data analysis, File IP disclosures

Seniority

Senior, hands-on IC