Silicon Product Integration
Core
Lead silicon product engineering, foundry engagement, and NPI execution for next-generation MEMS programs, serving as the technical bridge between design, manufacturing, and foundry partners.
Role type
Senior IC product engineer (semiconductor/MEMS)
Builds
Wafer and advanced packaging deliverables for next-generation MEMS programs
Domain
Semiconductor manufacturing / MEMS
Required skills
Product engineering, Yield engineering, Process integration, Device engineering, Failure analysis, Semiconductor manufacturing, Foundry engagement, NPI execution, Cross-functional program leadership
Preferred skills
MEMS development, High-volume manufacturing launch, Wafer foundry partner management, Complex technical program management
Technologies
MEMS, Wafer foundry, Advanced packaging
Responsibilities
Own silicon product engineering activities across development, qualification, ramp, and sustaining phases; Drive structural cost saving initiatives in wafer foundry and advanced packaging factories; Lead NPI silicon builds and ensure timely execution of deliverables; Partner with design, architecture, reliability, systems, and manufacturing teams to close technical issues; Drive issue resolution and technical solutions for process marginality and escalation; Serve as the primary technical interface with internal/external foundries and technology partners; Lead root-cause investigations and corrective actions related to yield, reliability, and manufacturability; Develop and manage technical schedules, milestones, dependencies, and risk mitigation plans for strategic MEMS programs.
Seniority
Senior, hands-on IC
