Lead Application Engineer Asia (f/m/d)
Core
Technical anchor for QuantumDiamonds in Asia, providing 2nd level application support, troubleshooting, and training for quantum magnetic field imaging systems used in semiconductor chip testing.
Role type
Senior IC application engineer (hardware/semiconductor)
Builds
QDm.1 quantum sensing technology for 3D current mapping in multi-layer chips
Domain
Semiconductor manufacturing / Quantum sensing / Hardware diagnostics
Required skills
hardware troubleshooting, failure analysis, technical training, customer engagement, system-level debugging, results interpretation, tool configuration
Preferred skills
semiconductor packaging (2.5D/3D), quantum sensing, magnetic imaging technology
Technologies
QDm.1 system, lab/fab equipment, firmware, software tools
Responsibilities
Provide 2nd level application support and troubleshoot system-level failures; Diagnose hardware defects and software issues on-site; Perform failure analysis on returned chips or boards; Develop and deliver technical training sessions for customers and distributors; Act as a bridge between Asia region and HQ application team; Present successfully implemented improvements to customers
Seniority
Senior, hands-on IC
