Staff -Principal Engineer of External Manufacturing Operation Engineering
Core
Drive continuous improvement in package quality, manufacturing processes, operational efficiency, and system robustness at external subcontractors.
Role type
Staff/Principal Manufacturing Operations Engineer (Semiconductor)
Builds
Robust manufacturing processes and quality systems for automotive-grade semiconductor products
Domain
Semiconductor manufacturing (Assembly/Testing) + Automotive
Required skills
Semiconductor assembly and packaging processes, Process/Quality Engineering, Root cause analysis (8D, 3-5 Why), Change control management, Risk assessment, Audit facilitation, Yield enhancement, Cost optimization, Material verification (MRB), Qualification activities
Preferred skills
VDA certification, IATF16949 certification, Power IC experience, Wire bond base knowledge (Ag, Au, Cu, Al)
Technologies
None explicitly listed
Responsibilities
Lead task force initiatives for process and quality improvements, Ensure process robustness and risk mitigation, Manage change control processes, Serve as communication bridge between BUs, customers, and project teams, Investigate EFAR and SQIN issues, Deploy Best Known Methods (BKMs), Facilitate customer and subcontractor audits, Manage daily subcontractor operations, Drive yield enhancement and process line drift reduction, Provide production support including MRB and disposition, Execute qualification activities for change management projects
Seniority
Staff/Principal, hands-on IC with leadership
