CareerPlan

Device Engineer

Gresham, OR, United StatesFull-time2026-10-19 → 2026-11-10

Core

Device Engineer optimizing silicon wafer fab production, yield, and manufacturability for sub-0.18um to 0.5um technology nodes.

Role type

Senior IC device engineer (silicon manufacturing)

Builds

Silicon semiconductor devices (CMOS, DMOS, Bipolars) and production processes

Domain

Semiconductor manufacturing / Silicon wafer fab

Required skills

Semiconductor device knowledge (CMOS, DMOS, Bipolars), wafer fabrication, yield enhancement, scrap reduction, process improvement, data analysis and statistics, defectivity control, lot-to-lot variation minimization

Preferred skills

Process/Device Integration, Circuit Design/Simulation, Test engineering, DOE and experiment analysis, post-fab manufacturing knowledge, GDS layout viewing and editing, debugging manufacturing sequences

Technologies

CMOS, DMOS, Bipolar devices, wafer fab equipment, GDS layout tools

Responsibilities

Enhance yield for production products, introduce new products into the fab, reduce scrap and defects, improve process throughput and cost, analyze manufacturing data to improve performance, present KPIs and trends to management

Seniority

Senior, hands-on IC