ENGR II, MANUFACTURING EQUIP; MFG

Seremban, Negeri Sembilan, MalaysiaFull-time2026-10-08 → 2026-11-11

Core

Lead front end assembly equipment team to ensure maximum uptime and perform advanced troubleshooting on die bond, clip bond, reflow, and inspection lines.

Role type

Senior Equipment Engineer (Manufacturing)

Builds

Front end assembly lines (die attach, clip bond, reflow, AOI)

Domain

Semiconductor manufacturing / Electronics assembly

Required skills

Equipment troubleshooting, Root cause analysis, Preventive maintenance, OEE analysis, Spare parts management, Kaizen/Lean Six Sigma, SOP development, Team leadership

Preferred skills

ASM/CANON equipment expertise, Process engineering collaboration, Yield optimization

Technologies

ASM AD838, AD8312PLUS, DA D510, ALPHASAM, AD830CB, AD830PLUS, BESTEM-C310, RO830, RO832, BOCS-6, PINK VADU, ASM DEK, CREST, PENTAMASTER AOI

Responsibilities

Lead and mentor shift technicians, Execute corrective and preventive maintenance, Analyze defect data to reduce waste, Drive continuous improvement initiatives, Manage spare parts inventory, Update technical documentation

Seniority

Senior, hands-on IC

About ON Semiconductor

Semiconductor Manufacturing15507Scottsdale, Arizona, US

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Learn more about onsemi at www.onsemi.com.