WETS Module Engineer
Core
Develop and support the manufacturing of 300mm silicon wafers for Automotive and Consumer applications, focusing on critical Cleans processes and equipment health.
Role type
Senior IC semiconductor process engineer (cleans module)
Builds
300mm silicon wafers for automotive and consumer electronics
Domain
Semiconductor manufacturing (cleans processes)
Required skills
Statistical process control (SPC), Design of Experiments (DOE), Fault Detection and Classification (FDC), Yield analysis, Root Cause Analysis, FMEA, Process qualification methodologies, Data analytics
Preferred skills
Master's or PhD in Engineering/Physical Sciences, Experience with SCREEN or TEL single wafer and BATCH platforms, Experience with automotive, power semiconductor, or image sensor technologies
Technologies
SCREEN, TEL, 300mm silicon wafers
Responsibilities
Own critical Cleans processes and associated equipment health, Implement equipment and process improvements to increase yield and throughput, Design and document experiments to improve cost and yield, Resolve complex technical problems to maintain production schedules, Provide daily process and product lot disposition support, Contribute to understanding and resolution of equipment-level performance shifts
Seniority
Mid-Senior, hands-on IC