Summer 2027 - Module Engineer Intern
Based in United States
Core
Support 300mm Post Fab manufacturing operations by collecting data, developing new process controls, and troubleshooting equipment to improve yield and device performance.
Role type
Summer Intern, Module Engineer
Builds
300mm semiconductor manufacturing processes and equipment performance
Domain
Semiconductor manufacturing (Post Fab)
Required skills
Data collection, process control development, equipment troubleshooting, yield improvement, material/process qualification, safety compliance
Preferred skills
Cross-functional collaboration, clear communication
Technologies
300mm manufacturing equipment, Post Fab wafer operations tools
Responsibilities
Collect data on equipment and processes, develop new process or controls, evaluate and qualify new materials and equipment, troubleshoot process issues to improve yield
Seniority
Intern